Updated on 2025/04/22

写真a

 
OHMI SHUN-ICHIRO
 
Organization
School of Engineering Associate Professor
Title
Associate Professor
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Degree

  • Doctor of Engineering ( Tokyo Institute of Technology )

Education

  • Tokyo Institute of Technology   Interdisciplinary Graduate School of Science and Engineering

    - 1996

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    Country: Japan

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  • Tokyo Institute of Technology   Graduate School, Division of Integrated Science and Engineering

    - 1996

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  • Nagoya University   School of Engineering

    - 1991

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    Country: Japan

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Research History

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Professional Memberships

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Committee Memberships

  • 電気学会   超集積化・環境CMOSデバイス調査専門委員会 委員長、全国大会 4G主査 、電子デバイス技術委員会 幹事補佐 、全国大会 4G幹事 、調査専門委員会 幹事 ・・・  

    2006 - 2008   

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    Committee type:Academic society

    超集積化・環境CMOSデバイス調査専門委員会 委員長、全国大会 4G主査 、電子デバイス技術委員会 幹事補佐 、全国大会 4G幹事 、調査専門委員会 幹事 、調査専門委員会 幹事補佐 、A部門誌 編集委員
    電気学会

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  • 電子情報通信学会   会誌編集委員会委員 、SDM委員会委員  

    2005   

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    Committee type:Academic society

    電子情報通信学会

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  • 応用物理学会   シリコンテクノロジー分科会 接合技術研究委員会 幹事  

    2001 - 2003   

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    Committee type:Academic society

    応用物理学会

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Books

  • Advances in the Understanding of Crystal Growth Mechanisms

    Elsevier Science  1997 

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  • Advances in the Understanding of Crystal Growth Mechanisms

    Elsevier Science  1997 

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MISC

  • Study on Stability of Pentacene-Based Metal-Oxide-Semiconductor Diodes in Air Using Capacitance-Voltage Characteristics

    Md. Akhtaruzzaman, Shun-Ichiro Ohmi, Jun-ichi Nishida, Yoshiro Yamashita, Hiroshi Ishiwara

    JAPANESE JOURNAL OF APPLIED PHYSICS   48 ( 4 )   04C178-1-3   2009.4

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    Language:English   Publisher:JAPAN SOC APPLIED PHYSICS  

    The stability of bottom-gate pentacene-based metal-oxide-semiconductor (MOS) diodes in air up to 30 days was investigated. The capacitance-voltage (C-V) characteristics of the pentacene film in air showed a slight hysteresis (36 mV) without any surface treatment for as-fabricated pentacene-based MOS diodes. However, after 30 days, the hysteresis width further increased to 100mV and flat-band voltages shifted toward positive voltage as well, which indicates that the electron trapping effects become stronger caused by either moisture or oxygen; thus, the stability of pentacene-based MOS diode characteristics degraded gradually. (C) 2009 The Japan Society of Applied Physics

    DOI: 10.1143/JJAP.48.04C178

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  • Study on Stability of Pentacene-Based Metal-Oxide-Semiconductor Diodes in Air Using Capacitance-Voltage Characteristics

    M. Akhtaruzzaman, S. Ohmi, J. Nishida, Y. Yamashita, H. Ishiwara

    Japan J. Appl. Phys.   48   04C178-1-3   2009

  • A proposal of TC-MOSFET and fabrication process of twin Si channels

    Shun-ichiro Ohmi, Tetsushi Sakai

    IEICE TRANSACTIONS ON ELECTRONICS   E90C ( 5 )   994 - 999   2007.5

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    Twin-Channel (TC)-MOSFET with twin omega-gate (Omega-gate) Si channels and its fabrication process were proposed. The twin Si channels are able to be fabricated by self-aligned process utilizing wet etching of SiN and silicon-on-insulator (SOI) wafers. Three-dimensional (3-D) device simulation was performed to optimize gate structure for TC-MOSFET with 10 nm x 10 nm (T-si x W-G) channels with the gate length of 30 nm, and it was found that TC-MOSFET with right-angled Omega-gate in case the L-under was 3 nm showed excellent device characteristics similar to the gate-all-around (GAA) devices corresponding to the gate structure as L-under = 5 nm. Fabrication process of twin Si channels was also investigated experimentally, and approximately 40 nm x 40 nm twin Si channels were successfully fabricated on SOI by the proposed fabrication process.

    DOI: 10.1093/ietele/e90-c.5.994

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  • Mechanism of selective etching of SiGe layers in SiGe/Si systems

    J. Kato, H. Oka, K. Kanemoto, H. Hisamatsu, Y. Matsuzawa, Y. Kitano, T. Hara, M. Hoshina, S. Ohmi

    ECS Transactions   6 ( 8 )   245 - 251   2007

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    Selective lateral etching of the SiGe layer for various Si/SiGe/Si systems was studied. We showed the different etching rates for SiGe layers with the same thickness and Ge concentration, but with different structures of the Si/SiGe/Si stacked layer. We described a mechanism that could explain the experimental results of selective etching of SiGe layers in Si/SiGe/Si systems. According to the mechanism, we were able to summarize the following 3 key points in realizing high selectivity SiGe etching. 1) Should be the SiGe layer in a higher oxidation state (enough number of holes), 2) a wider area is necessary for Si substrate surface in contact with the solution, and 3) the current path should be maintained at the SiGe/Si interface. ©The Electrochemical Society.

    DOI: 10.1149/1.2794470

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  • Fabrication of SOI MOSFET by "separation by bonding silicon islands (SBSI)" method

    K. Kanemoto, H. Oka, H. Hisamatsu, Y. Matsuzawa, Y. Kitano, T. Hara, M. Hoshina, S. Ohmi, J. Kato

    ECS Transactions   6 ( 4 )   309 - 313   2007

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    Local SOI MOSFETs were fabricated in the designed area on a Si bulk substrate using the separation by bonding silicon islands (SBSI) method. We describe the key fabrication process technology and show the electrical characteristics. The SBSI method consists of three key technologies: epitaxial growth of SiGe having high germanium concentration, lateral selective etching of SiGe, and bonding of buried oxides (BOX) grown in the gap. Epitaxial growth of 30 nm-thick Si063Ge037 without crystalline defects was achieved by reducing the growth temperature to as low as 450 °C The Si/Si063Ge037 structure allowed lateral etching of Si 063Ge037 with a length of 1 μm m 2 minutes and with negligible etching of Si in a solution of hydrofluoric acid and nitric acid. Fabricated MOSFETs showed excellent characteristics, which were comparable to those of SOI wafers, although a small gap still remained in the BOX. © The Electrochemical Society.

    DOI: 10.1149/1.2728875

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  • Fabrication of SOI MOSFET by "separation by bonding silicon islands (SBSI)" method

    K. Kanemoto, H. Oka, H. Hisamatsu, Y. Matsuzawa, Y. Kitano, T. Hara, M. Hoshina, S. Ohmi, J. Kato

    ECS Transactions   6 ( 4 )   309 - 313   2007

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    Local SOI MOSFETs were fabricated in the designed area on a Si bulk substrate using the separation by bonding silicon islands (SBSI) method. We describe the key fabrication process technology and show the electrical characteristics. The SBSI method consists of three key technologies: epitaxial growth of SiGe having high germanium concentration, lateral selective etching of SiGe, and bonding of buried oxides (BOX) grown in the gap. Epitaxial growth of 30 nm-thick Si063Ge037 without crystalline defects was achieved by reducing the growth temperature to as low as 450 °C The Si/Si063Ge037 structure allowed lateral etching of Si 063Ge037 with a length of 1 μm m 2 minutes and with negligible etching of Si in a solution of hydrofluoric acid and nitric acid. Fabricated MOSFETs showed excellent characteristics, which were comparable to those of SOI wafers, although a small gap still remained in the BOX. © The Electrochemical Society.

    DOI: 10.1149/1.2728875

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  • Ultrathin HfOxNy gate insulator formation by electron cyclotron resonance Ar/N-2 plasma nitridation of HfO2 thin films

    Shun-ichiro Ohmi, Tomoki Kurose, Masaki Satoh

    IEICE TRANSACTIONS ON ELECTRONICS   E89C ( 5 )   596 - 601   2006.5

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    HfOxNy thin films formed by the electron cyclotron resonance (ECR) Ar/N-2 plasma nitridation of HfO2 films were investigated for high-k gate insulator applications. HfOxNy thin films formed by the ECR Ar/N-2 plasma nitridation (60 s) of 1.5-nm-thick HfO2 films, which were deposited on chemically oxidized Si(100) substrates, were found to be effective for suppressing interfacial layer growth or crystallization during postdeposition annealing (PDA) in N-2 ambient. After 900 degrees C PDA of for 5 min in N-2 ambient, it was found that HfSiON film with a relatively high dielectric constant was formed on the HfOxNy/Si interface by Si diffusion. An equivalent oxide thickness (EOT) of 2.0 nm and a leakage current density of 1.0 x 10(-3) A/cm(2) (at V-FB-1V) were obtained. The effective mobility of the fabricated p-channel metal-insulator-semiconductor field-effect transistor (MISFET) with the HfOxNy gate insulator was 50 cm(2)/Vs, and the gate leakage current of the MISFET with the HfOxNy gate insulator was found to be well suppressed compared with the MISFET with the HfO2 gate insulator after 900 degrees C PDA because of the nitridation of HfO2.

    DOI: 10.1093/ietele/e89-c.5.596

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  • Thermal stability of Gd2O3/Si(100) interfacial transition layer

    H Nohira, T Yoshida, H Okamoto, S Shinagawa, W Sakai, K Nakajima, M Suzuki, K Kimura, NJ Aun, Y Kobayashi, S Ohmi, H Iwai, E Ikenaga, Y Takata, K Kobayashi, T Hattori

    JOURNAL DE PHYSIQUE IV   132   273 - 277   2006.3

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    Language:English   Publisher:EDP SCIENCES S A  

    Thermal stability of Gd2O3/Si(100) interfacial transition layer was studied by analyzing the angle-resolved Si 2p and Gd 4d photoelectron spectra. Following results were obtained: The compositional depth profile of Gd2O3/Si(100) changed slightly by post deposition annealing (PDA) in nitrogen gas under atmospheric pressure below 300 degrees C. The analyses of 0 1s and Si 2p spectra indicated that the Gd-silicate consisting of Gd-O-Si bonds was produced near the Gd2O3/Si(100) interface without annealing and the amount of Gd-silicate increased by PDA above 400 degrees C.

    DOI: 10.1051/jp4:2006132052

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  • Effects of low temperature annealing on the ultrathin La2O3 gate dielectric; comparison of post deposition annealing and post metallization annealing

    JA Ng, Y Kuroki, N Sugii, K Kakushima, SI Ohmi, K Tsutsui, T Hattori, H Iwai, H Wong

    MICROELECTRONIC ENGINEERING   80   206 - 209   2005.6

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    This Work reports the effects of low-temperature post-deposition annealing (PDA) and post-metallization annealing (PMA) on the electrical properties of ultrathin (with EOT ranging from 1.29 nm to 2.33 nm) La2O3 gate dielectric films. We found that positive charges were generated during the PDA as evidenced by the negative flat-band voltage (V-FB) shift. Forming of La-silicate interface layer and a reduction in the channel mobility are found for the PDA samples at temperature higher than 300 degrees C. Better electrical characteristics were achieved by the PMA. The PMA sample has a peak channel mobility of 319 cm(2)/Vs.

    DOI: 10.1016/j.mee.2005.04.019

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  • Analysis of variation in leakage currents of Lanthana thin films

    Y Kim, S Ohmi, K Tsutsui, H Iwai

    SOLID-STATE ELECTRONICS   49 ( 5 )   825 - 833   2005.5

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    Language:English   Publisher:PERGAMON-ELSEVIER SCIENCE LTD  

    Lanthana (La2O3) films were deposited by E-beam evaporation on n-Si(100). Conduction mechanisms for the as-deposited film have been investigated. In order to study the annealing effect of the as-deposited films on the conduction mechanisms, some films were annealed in an ex situ way at different temperatures with nitrogen or oxygen gas flow for 5 min. From current-voltage measurement of the as-deposited films, extremely low gate oxide leakage currents were observed while some films showed variation in the scale of the currents. It is shown that all the currents of as-deposited films obey the same conduction mechanisms irrelevant of the magnitude of the leakage currents. From the electric field and temperature dependences of the currents of the gate oxide, it is shown that the main conduction mechanisms are the space-charge limited current (SCLC) at low oxide field region and Fowler-Nordheim (F-N) conduction at high oxide field region. It is also shown that conduction mechanisms of the nitrogen annealed films were basically the same as those of the as-deposited films although the magnitude of the conduction current and flat-band voltage (V-FB) are different. (c) 2005 Elsevier Ltd. All rights reserved.

    DOI: 10.1016/j.see.2005.01.002

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  • Separation by bonding Si islands (SBSI) for advanced CMOS LSI applications

    T Yamazaki, S Ohmi, S Morita, H Ohri, J Murota, M Sakuraba, H Omi, T Sakai

    IEICE TRANSACTIONS ON ELECTRONICS   E88C ( 4 )   656 - 661   2005.4

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    We have developed separation by bonding Si islands (SBSI) process for advanced CMOS LSI applications. In this process, the Si islands that become the SOI regions are formed by selective etching of the SiGe layer in the Si/SiGe stacked layers, and those are bonded to the Si substrate with the thermal oxide layers by furnace annealing. The etching selectivity for SiGe/Si and surface roughness after the SiGe etching were found to be improved by decreasing the HNO3 concentration in the etching solution. The thicknesses of the fabricated Si island and the buried oxide layer also became uniform by decreasing the HNO3 concentration. In addition, it was found that the space formed by SiGe etching in the Si/SiGe stacked layers was able to be filled with the thermal oxide layer without furnace annealing.

    DOI: 10.1093/ietele/e88-c.4.656

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  • Separation by bonding Si islands (SBST) for LSI applications

    T Yamazaki, S Ohmi, S Morita, H Ohri, J Murota, M Sakuraba, H Omi, Y Takahashi, T Sakai

    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING   8 ( 1-3 )   59 - 63   2005.2

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    We propose and describe a novel method called separation by bonding Si islands (SBSI) that can be used to form silicon-on-insulator (SOI) and isolation regions simultaneously. The Si islands are formed by selectively etching the SiGe layer of Si/SiGe stacked layers grown by chemical vapor deposition (CVD). Thin oxide layers are formed at the surface of the Si islands and the Si substrate by using thermal oxidation, and the Si islands are bonded to the Si substrate with the oxide layers. We obtained a uniform Sol layer and a smooth interface between the Sol and buried oxide (BOX) layers. The thicknesses of the Sol and BOX layers observed with cross-sectional transmission electron microscopy (TEM) were 18.2 and 23.5nm, respectively. (C) 2004 Elsevier Ltd. All rights reserved.

    DOI: 10.1016/j.mssp.2004.09.082

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  • Electrical properties of vacuum annealed La2O3 thin films grown by E-beam evaporation

    Y Kim, K Miyauchi, S Ohmi, K Tsutsui, H Iwai

    MICROELECTRONICS JOURNAL   36 ( 1 )   41 - 49   2005.1

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    In this article, the conduction mechanisms of metal-oxide- semiconductor with vacuum annealed Lanthana (La2O3) oxide film are investigated. Lanthana films with thicknesses of 3.5, 4.7, and 11 nm were deposited by E-beam evaporation on n-Si (100), and annealed at various temperatures (300-500degreesC) in ultra-high vacuum (10(-10)-10(-9) Torr) for 90 min. From the measurement of spectroscopic ellipsometry, it is found that film thickness is increased with annealing temperature, which would be cause of flat-band voltage shift (DeltaV(FB)) due to the growth of interfacial layer. From the capacitance measurement, it is found that DeltaV(FB) of the film is reduced by post-deposition anneal (PDA) compared to that of as-deposited film, but increase again at high temperature annealing, especially in the case of thin film (3.5 nm). From the applied voltage and temperature dependence of the leakage current of the film, with different gate electrode materials (Ag, Al, and Pt), it is shown that the leakage currents are associated with ohmic and Poole-Frenkel (P-F) conductions when flat-band voltage (V-FB) is less than zero, and ohmic and Space-Charge-Limited Current (SCLC) conductions when V-FB is greater than zero. The dielectric constants obtained from P-F conduction for Al gate electrode case is found to be 11.6, which is consistent with the C-V result 11.9. Barrier height of trap potential well is found to be 0.24 eV from P-F conduction. Based on SCLC theory, leakage currents of 3.5 and 11 nm films with different PDA temperatures are explained in terms of oxide trap density. (C) 2004 Elsevier Ltd. All rights reserved.

    DOI: 10.1016/j.mejo.2004.10.010

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  • ECR Ar/O_2_ Plasma Oxidation of HfN Thin Films for High Dielectric HfO_x_N_y_ Formations

    T. Kurose, T. Uchikawa, S. Ohmi, T. Sakai

    Trans. Mat. Res. Soc. Japan   30   209 - 212   2005

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  • MIM構造の高誘電率La_2_O_3_薄膜におけるリーク電流機構

    福山享, 金容湜, 大見俊一郎, 筒井一生, 岩井洋

    第52回応用物理学関係連合講演会講演予稿集   2   918   2005

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  • Dry Etching of Cr_2_O_3_/Cr Stacked Film during Resist Ashing by Oxygen Plasma

    Junichi Tonotani, Shun-ichiro Ohmi Hiroshi Iwai

    Jpn. J. Appl. Phys.   44   114 - 117   2005

  • HfNのECR Ar/O_2_プラズマ酸化により形成したHfO_x_N_y_薄膜の熱処理に関する検討

    黒瀬朋紀, 内川偉史, 大見俊一郎, 酒井徹志

    第52回応用物理学関係連合講演会講演予稿集   2   899   2005

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  • LaO_x_/YO_x_/Si界面組成遷移層の化学結合状態の熱処理依存性

    吉田徹史, 松田徹, 岡本英介, 品川盛治, 野平博司, 中川健太郎, 黒木裕介, 宮内邦裕, 大見俊一郎, 岩井洋, 池永英司, 高田恭孝, 小林啓介, 服部健雄

    第52回応用物理学関係連合講演会講演予稿集   2   918   2005

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  • ECR Ar/O_2_ Plasma Oxidation of HfN Thin Films for High Dielectric HfO_x_N_y_ Formations

    T. Kurose, T. Uchikawa, S. Ohmi, T. Sakai

    Trans. Mat. Res. Soc. Japan   30   209 - 212   2005

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  • Dry Etching of Cr_2_O_3_/Cr Stacked Film during Resist Ashing by Oxygen Plasma

    Junichi Tonotani, Shun-ichiro Ohmi Hiroshi Iwai

    Jpn. J. Appl. Phys.   44   114 - 117   2005

  • Effects of post dielectric deposition and post metallization annealing processes on metal/Dy2O3/Si(100) diode characteristics

    S Ohmi, H Yamamoto, J Taguchi, K Tsutsui, H Iwai

    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS   43 ( 4B )   1873 - 1878   2004.4

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    Ultra-high vacuum annealing was investigated for Dy2O3 films deposited on Si(100) substrates. The leakage current of the Dy2O3 films deposited at room temperature (RT) was found to be decreased without any increase of the equivalent oxide thickness (EOT) by the in-situ vacuum annealing method compared to that of the conventional rapid thermal annealing (RTA) in O-2. The negative flat-band voltage (V-FB) shift observed after the in-situ vacuum annealing process was suppressed by increasing, the deposition temperature of Dy2O3 on chemically oxidized Si from RT to 250degreesC. The EOT of 1.1 nm with the (@V-FB + 1 V) was obtained for the Dy2O3 film after the air-brake and vacuum annealing, and leakage current of 0.29 A/cm(2) a the EOT of 0.63 nm with 4 A/cm(2) (@VFB + 1 V) was achieved for the Dy2O3 film with the TaN gate electrode after the post metallization annealing (PMA).

    DOI: 10.1143/JJAP.43.1873

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  • Proposal of a multi-layer channel MOSFET: the application of selective etching for Si/SiGe stacked layers

    D Sasaki, S Ohmi, M Sakuraba, J Murota, T Sakai

    APPLIED SURFACE SCIENCE   224 ( 1-4 )   270 - 273   2004.3

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    A multi-layer channel MOSFET (ML-MOSFET) and its fabrication process were proposed for future CMOS application. ML-MOSFET has multi-Si channel layers stacked vertically, so that the drain current per 1 mum gate width on wafer is expected to increase with the number of channel layers compared to conventional double-gate MOSFET. I-on = 3.9 mA/mum was obtained for ML-MOSFET with three Si channel layers (L-g: 10 mn, T-Si: 2.5 nm) by the device simulation. Fabrication process of multilayer channel using selective etching for SiGe/Si stacked layers was also investigated. (C) 2003 Published by Elsevier B.V.

    DOI: 10.1016/j.apsusc.2003.08.107

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  • Characterization of AlON thin films formed by ECR plasma oxidation of AlN/Si(100)

    S Ohmi, G Yamanaka, T Sakai

    IEICE TRANSACTIONS ON ELECTRONICS   E87C ( 1 )   24 - 29   2004.1

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    Electron cyclotron resonance (ECR) plasma oxidation of AlN thin films was studied to form the AlON high-kappa gate insulator. The leakage current was found to be decreased, and also the surface roughness was improved with the ECR plasma oxidation of AlN thin films. The leakage current was further decreased after 1000degreesC RTA in N-2 with little increase of equivalent oxide thickness (EOT) because of the high quality interfacial layer formation.

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  • 高誘電率La_2_O_3_薄膜におけるリーク電流機構の解析

    福山享, 金容提, 大見俊一郎, 筒井一生, 岩井洋

    第65回応用物理学会学術講演会   2   686   2004

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  • 高誘電率La_2_O_3_薄膜におけるリーク電流機構の解析

    金容提, 大見俊一郎, 筒井一生, 岩井洋

    第51回応用物理学関係連合講演会   2   870   2004

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  • La_2_O_3_をゲート絶縁膜に用いたMISFETの低周波ノイズのアニール雰囲気依存性

    吉田丈治, ヘンドリアッシャサウッディン, 大見俊一郎, 筒井一生, 岩井洋

    第51回応用物理学関係連合講演会   2   869   2004

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  • La_2_O_3_薄膜における電気特性のアニール時間依存性

    宮内邦裕, 大見俊一郎, 筒井一生, 岩井洋

    第51回応用物理学関係連合講演会   2   870   2004

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  • La_2_O_3_薄膜に対する熱処理に関する検討

    黄仁安, 栗山篤, 大見俊一郎, 筒井一生, 岩井洋

    第51回応用物理学関係連合講演会   2   869   2004

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  • HfNのECR Ar/O_2_プラズマ酸化によるHfO_x_N_y_薄膜の形成

    黒瀬朋紀, 内川偉史, 大見俊一郎, 酒井徹志

    第65回応用物理学会学術講演会   2   679   2004

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  • La_2_O_3_をゲート絶縁膜に用いたMISFETにおけるポストメタライゼーションアニールの効果に関する検討

    黒木裕介, 黄仁安, 栗山篤, 大見俊一郎, 筒井一生, 岩井洋

    第65回応用物理学会学術講演会   2   686   2004

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  • プラズマドーピングにおけるHeプラズマ後処理による不純物プロファイル制御

    高木克洋, 佐藤貴久, 田村秀貴, 筒井一生, 佐々木雄一朗, 水野文二, 大見俊一郎, 岩井洋

    第51回応用物理学関係連合講演会   2   945   2004

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  • 新構造Double-Gate MOSFETの作製プロセスに関する検討

    中港努, 世古裕亮, 大見俊一郎, 酒井徹志

    第51回応用物理学関係連合講演会   2   976   2004

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  • SiGe/Si層におけるSiGe層選択エッチング特性

    大理洋征龍, 山崎崇, 盛田伸也, 関川智英, 大見俊一郎, 酒井徹志

    第51回応用物理学関係連合講演会   2   936   2004

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  • プラズマドーピング後の基板洗浄がドーズに与える影響

    佐藤貴久, 田村秀貴, 檜垣良太, 佐々木雄一朗, 水野文二, 筒井一生, 大見俊一郎, 岩井洋

    第51回応用物理学関係連合講演会   2   945   2004

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  • 極薄SOI上に形成したPtSiの耐熱性

    加藤有亮, 古山直人, 鈴木貴也, 大見俊一郎, 酒井徹志

    第51回応用物理学関係連合講演会   2   907   2004

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  • Si/SiGe/Si構造におけるSiGe層選択エッチングのGe組成比およびアニール温度依存性

    山崎崇, 関川智英, 袴田佳孝, 大見俊一郎, 酒井徹志

    第51回応用物理学関係連合講演会   2   936   2004

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  • ECRスパッタ法により形成したHfO_x_N_y_薄膜の熱処理に関する検討

    内川偉史, 山中剛, 大見俊一郎, 酒井徹志

    第51回応用物理学関係連合講演会   2   883   2004

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  • 極浅プレアモルファス層によるTiSi_2_形成膜厚制御

    古山直人, 加藤有亮, 大見俊一郎, 酒井徹志

    第51回応用物理学関係連合講演会   2   907   2004

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  • Characterization of AlON Thin Films Formed by ECR Plasma Oxidation of AlN/Si(100)

    S. Ohmi, G. Yamanaka, T. Sakai

    IEICE Trans. Electron.   E87-C ( 1 )   24 - 29   2004

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  • Characterization of Lu_2_O_3_ Thin Films Fabricated by E-beam Deposition Method

    S. Ohmi M. Takeda, H. Ishiwara, H. Iwai

    J. Electrochem. Soc.   151 ( 4 )   G279 - G283   2004

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  • Proposal of Multi-Layer Channel MOSFET: The Application of Selective Etching for Si/SiGe Stacked Layers

    D. Sasaki, S. Ohmi, M. Sakuraba, J. Murota, T. Sakai

    Appl. Surf. Sci.   224   270 - 273   2004

  • Characterization of Lu_2_O_3_ Thin Films Fabricated by E-beam Deposition Method

    S. Ohmi M. Takeda, H. Ishiwara, H. Iwai

    J. Electrochem. Soc.   151 ( 4 )   G279 - G283   2004

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  • LaO_x_/Si界面組成遷移層の化学結合状態の熱処理依存性

    野平博司, 吉田徹史, 岡本英介, 品川盛治, 酒井渉, 中島薫, 鈴木基史, 木村健二, NgJinAun, 小林洋一, 宮内邦裕, 吉田丈治, 大見俊一郎, 岩井洋, 池永英司, 高田恭孝, 辛

    第65回応用物理学会学術講演会   2   688   2004

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  • 極薄SOI層と素子間分離領域を一体化する新技術:SBSI(Separation by Bonding Si Islands) -Si島とSi基板間の熱酸化-

    大理洋征龍, 山崎崇, 盛田伸也, 袴田佳孝, 大見俊一郎, 酒井徹志

    第65回応用物理学会学術講演会   2   745   2004

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  • La_2_O_3_をゲート絶縁膜に用いたMISFETの低周波ノイズのアニール温度依存性

    吉崎智史, 吉田丈治, 大見俊一郎, 筒井一生, 岩井洋

    第65回応用物理学会学術講演会   2   686   2004

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  • GdO_x_/Si界面組成遷移層の化学結合状態の深さ方向分布の熱処理依存性

    吉田徹史, 岡本英介, 品川盛治, 野平博司, 酒井渉, 中島薫, 鈴木基史, 木村健二, 吉田丈治, 大見俊一郎, 岩井洋, 池永英司, 高田恭孝, 辛埴, 小林啓介, 服部健雄

    第65回応用物理学会学術講演会   2   688   2004

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  • Dry etching characteristics of TiN film using Ar/CHF3, Ar/Cl-2, and Ar/BCl3 gas chemistries in an inductively coupled plasma

    J Tonotani, T Iwamoto, F Sato, K Hattori, S Ohmi, H Iwai

    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B   21 ( 5 )   2163 - 2168   2003.9

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    Dry etching characteristics of TiN film have been studied in the case of using Ar/CHF3, Ar/Cl-2, and Ar/BCl3 chemistries in an inductively coupled plasma. The TiN film was not etched at all without the addition of CHF3, BCl3, or Cl-2 to the Ar gas flow. On the other hand, it was found that the TiN film was etched with one of the earlier additional gases. It was also found that a nontapered profile of etched TiN is obtained by Cl-2 addition and a tapered profile by CHF3 or BCl3 addition. Moreover, a lower taper angle is obtained by increasing the amount of additional BCl3. X-ray photoelectron spectroscopy and Auger electron spectroscopy analyses for the etched samples of TiN show that TiF3 exists on the etched surface of TiN in the case of CHF3 addition and that BOxNy exists in the case of BCl3 addition. On the basis of these results, the effect of the gas addition to Ar on the characteristics of TiN reactive ion etching is considered as follows; under the Ar/CHF3 condition, although N in the TiN film is removed by evaporation in the form of NFx, Ti is fluorinated to form TiFx having low vapor pressure, which results in the low etching rate. Under the Ar/Cl-2 condition, since NClx and TiClx have high vapor pressures, TiN is easily etched off, resulting in the highest etching rate with a nontapered profile. Under the Ar/BCl3 condition, although Cl plays the same role as it does under the Ar/Cl-2 condition, B is likely to form a nonvolatile compound such as BOxNy, resulting in the deposition of the nonvolatile films on both the upper surface and sidewall of the TiN, which leads to a lower etching rate than that in the case of Cl-2 addition and a lower taper angle of the etched profile. (C) 2003 American Vacuum Society.

    DOI: 10.1116/1.1612517

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  • Characterization of La2O3 and Yb2O3 thin films for high-k gate insulator application

    S Ohmi, C Kobayashi, Kashiwagi, I, C Ohshima, H Ishiwara, H Iwai

    JOURNAL OF THE ELECTROCHEMICAL SOCIETY   150 ( 7 )   F134 - F140   2003.7

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    Rare earth oxides, such as La2O3 and Yb2O3, deposited on Si(100) were investigated for high-k gate insulator applications. La2O3 has the largest bandgap and smallest lattice energy among the rare earth oxides, while Yb2O3 has a smaller bandgap and larger lattice energy compared to La2O3. La2O3 showed excellent electrical properties, such as small capacitance equivalent thickness and low leakage current density with smooth film surface and interface after rapid thermal annealing (RTA) at 400-600degreesC. On the other hand, the surface of Yb2O3 thin film was easily roughened after RTA even at 400degreesC, and the leakage current density was higher compared to La2O3. The difference in characteristics for the films was considered to be attributed to the difference of their properties, such as bandgap and lattice energy. La2O3 was able to keep the amorphous phase at least up to 600degreesC RTA, and this seems promising for future high-k gate insulator applications. (C) 2003 The Electrochemical Society.

    DOI: 10.1149/1.1581278

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  • Effect of surface treatment of Si substrates and annealing condition on high-k rare earth oxide gate dielectrics

    C Ohshima, J Taguchi, Kashiwagi, I, H Yamamoto, S Ohmi, H Iwai

    APPLIED SURFACE SCIENCE   216 ( 1-4 )   302 - 306   2003.6

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    Language:English   Publisher:ELSEVIER SCIENCE BV  

    Effect of chemical oxide and low temperature long time annealing on the electrical characteristics for rare earth oxides deposited on Si(1 0 0) were investigated.
    Formation of chemical oxide on Si substrates prior to the Gd2O3 depositions was found to decrease the leakage current significantly compared the films deposited on HF-last Si substrate, when the thickness was 3.5 nm or thicker, while the effect was not observed when the thickness was 2.8 nm. Annealing at 400 degreesC for 90 min also decreased leakage current of Dy2O3 thin films with little increase of capacitance equivalent thickness (CET). (C) 2003 Elsevier Science B.V. All rights reserved.

    DOI: 10.1016/S0169-4332(03)00439-2

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  • Chemical and electronic structures of Lu2O3/Si interfacial transition layer

    H Nohira, T Shiraishi, T Nakamura, K Takahashi, M Takeda, S Ohmi, H Iwai, T Hattori

    APPLIED SURFACE SCIENCE   216 ( 1-4 )   234 - 238   2003.6

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    The composition of transition layer (TL) formed between Lu2O3 and Si(1 0 0) substrate was determined non-destructively by applying newly developed depth profiling method to the angle-resolved Si 2p and Lu 4d photoelectron spectra. The conduction and valence band alignments of Lu2O3 with respect to Si(1 0 0) were also determined from the measurement of 0 Is photoelectron spectra and valence band spectra. (C) 2003 Elsevier Science B.V. All rights reserved.

    DOI: 10.1016/S0169-4332(03)00425-2

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  • チャネル多層化 新構造Multi-Layer Channel MOSFET

    大見俊一郎

    第50回応用物理学関係連合講演会 講演予稿集   2   965   2003

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  • LuO_x_極薄膜の深さ方向組成・化学結合状態分析

    白石貴義, 竹林一騎, 高橋健介, 野平博司, 柏木郁未, 大島千鶴, 大見俊一郎, 岩井洋, 城森慎司, 中嶋薫, 鈴木基史, 木村健二, 服部健雄

    第50回応用物理学関係連合講演会   2   869   2003

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  • LuO_x_極薄膜中のシリケート

    吉田徹史, 白石貴義, 高橋健介, 野平博司, 柏木郁未, 大島千鶴, 大見俊一郎, 岩井洋, 城森慎司, 中嶋薫, 鈴木基史, 木村健二, 服部健雄

    第50回応用物理学関係連合講演会   2   870   2003

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  • 高誘電率希土類酸化物の積層構造に関する検討

    上田功, 大見俊一郎, 筒井一生, 岩井洋

    第50回応用物理学関係連合講演会   2   869   2003

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  • La_2_O_3_, Gd_2_O_3_およびLu_2_O_3_極薄膜の高分解能RBS による分析

    中嶋薫, 城森慎司, 鈴木基史, 木村健二, 大見俊一郎, 岩井洋

    第50回応用物理学関係連合講演会   2   869   2003

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  • 希土類酸化物薄膜における超高真空アニールの効果に関する検討

    山本浩之, 栗山篤, 大見俊一郎, 筒井一生, 岩井洋

    第50回応用物理学関係連合講演会   2   872   2003

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  • TaN ゲート電極のRIE特性

    戸野谷純一, 大見俊一郎, 岩井洋

    第50回応用物理学関係連合講演会   2   935   2003

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  • 希土類酸化物の電気特性におけるSi基板面方位依存性

    柏木郁未, 大見俊一郎, 筒井一生, 岩井洋

    第50回応用物理学関係連合講演会   2   871   2003

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  • TaN/Dy_2_O_3_/n-Si(100)構造に置ける電気特性のアニール条件依存性

    田口順一, 大見俊一郎, 筒井一生, 岩井洋

    第50回応用物理学関係連合講演会   2   872   2003

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  • 高誘電率Gd_2_O_3_薄膜のSi 基板表面処理の効果

    大島千鶴, 吉原義昭, 大見俊一郎, 筒井一生, 岩井洋

    第50回応用物理学関係連合講演会   2   871   2003

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  • 希土類酸化物薄膜におけるポストアニールに関する検討

    栗山篤, 大見俊一郎, 筒井一生, 岩井洋

    第50回応用物理学関係連合講演会   2   871   2003

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  • 希土類酸化物極薄膜中のシリケートとシリサイド

    野平博司, 白石貴義, 高橋健介, 柏木郁未, 大島千鶴, 大見俊一郎, 岩井洋, 城森慎司, 中嶋薫, 鈴木基史, 木村健二, 高田恭孝, 小林啓介, 辛埴, 服部健雄

    第50回応用物理学関係連合講演会   2   870   2003

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  • プラズマドーピング法におけるH 等の深さ分布プロファイルの挙動とコンタミの検討

    佐々木雄一朗, 水野文二, 赤間貞洋, 檜垣良太, 大見俊一郎, 筒井一生, 岡下勝己, 前嶋聡, 吉川住和, 中山一郎, 岩井洋

    第50回応用物理学関係連合講演会   2   941   2003

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  • 室温ガスドーピング法におけるドーズ量の制御

    檜垣良太, 赤間貞洋, 筒井一生, 佐々木雄一朗, 水野文二, 吉川住和, 大見俊一郎, 岩井洋

    第50回応用物理学関係連合講演会   2   941   2003

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  • 室温ガスドーピングの表面反応機構

    赤間貞洋, 檜垣良太, 筒井一生, 佐々木雄一朗, 水野文二, 吉川住和, 大見俊一郎, 岩井洋“

    第50回応用物理学関係連合講演会   2   941   2003

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  • プラズマドーピング前後のHF 洗浄とドーズ量の変化

    佐藤貴久, 檜垣良太, 筒井一生, 佐々木雄一朗, 田村秀貴, 金成国, 水野文二, 大見俊一郎, 岩井洋

    第64回応用物理学関係連合講演会   2   772   2003

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  • Composition, Chemical Structure and Electronic Band Structure of Rare Earth Oxide/Si(100) Interfacial Transition Layer

    T.Hattori, T.Yoshida, T.Shiraishi, K.Takahashi, H.Nohira, S.Joumori, K.Nakajima, M.Suzuki K.Kimura, I.Kashiwagi C.Ohshima, S.Ohmi H.Iwai

    INFOS2003   WS1-9   2003

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  • La_2_O_3_薄膜におけるポストメタルアニールに関する検討

    黄仁安, 栗山篤, 大見俊一郎, 筒井一生, 岩井洋

    第64回応用物理学関係連合講演会   2   736   2003

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  • プラズマ前処理を用いたガスドーピングにおける基板表面状態の影響

    檜垣良太, 筒井一生, 佐々木雄一朗, 水野文二, 吉川住和, 大見俊一郎, 岩井洋

    第64 回応用物理学関係連合講演会   2   771   2003

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  • 電子ビーム蒸着法により形成した高誘電率La_2_O_3_薄膜における漏れ電流特性

    宮内邦裕, 金容湜, 大見俊一郎, 筒井一生, 岩井洋

    第64回応用物理学関係連合講演会   2   735   2003

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  • La_2_O_3_をゲート絶縁膜に用いたMISFET の低周波ノイズ

    吉田丈治, ヘンドリアンシャーサウッディン, 大見俊一郎, 筒井一生, 岩井洋

    第64回応用物理学関係連合講演会   2   736   2003

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  • LaO_x_極薄膜の組成・化学結合状態の深さ方向分析(II)

    白石貴義, 吉田徹史, 野平博司, 柏木郁未, 大島千鶴, 大見俊一郎, 岩井洋, 城森慎司, 中嶋薫, 鈴木基史, 木村健二, 服部健雄

    第64回応用物理学関係連合講演会   2   735   2003

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  • 高誘電率希土類酸化物の積層構造に関する検討

    小林洋一, 上田功, 大見俊一郎, 筒井一生, 岩井洋

    第64回応用物理学関係連合講演会   2   735   2003

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  • Effects of gas phase absorption into Si substrates on plasma doping process

    R.Higaki, K.Tsutsui, Y.Sasaki, S.Akama, B.Mizuno, S.Ohmi H.Iwai

    ESSDERC 2003   231 - 234   2003

  • Analysis of Electrical Characteristics of La_2_O_3_ Thin Films Annealed in Vacuum and Others

    Y.Kim A.Kuriyama I.Ueda, S. Ohmi, K.Tsutsui H.Iwai

    ESSDERC 2003   569 - 572   2003

  • Effects of gas phase absorption into Si substrates on plasma doping process

    R.Higaki, K.Tsutsui, Y.Sasaki, S.Akama, B.Mizuno, S.Ohmi H.Iwai

    ESSDERC 2003   231 - 234   2003

  • Analysis of Electrical Characteristics of La_2_O_3_ Thin Films Annealed in Vacuum and Others

    Y.Kim A.Kuriyama I.Ueda, S. Ohmi, K.Tsutsui H.Iwai

    ESSDERC 2003   569 - 572   2003

  • 希土類酸化物薄膜のゲート絶縁膜応用

    大見俊一郎

    電気学会誘電体薄膜材料技術調査専門委員会 第8回委員会   2003

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  • Composition, Chemical Structure and Electronic Band Structure of Rare Earth Oxide/Si(100) Interfacial Transition Layer

    T.Hattori, T.Yoshida, T.Shiraishi, K.Takahashi, H.Nohira, S.Joumori, K.Nakajima, M.Suzuki K.Kimura, I.Kashiwagi C.Ohshima, S.Ohmi H.Iwai

    INFOS2003   WS1-9   2003

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  • Electrical Characteristics of High-k La_2_O_3_ Thin Film Deposited by E-Beam Evaporation Method

    Y.Kim S.Ohmi, K.Tsusui H.Iwai

    204^th^ ECS Meeting   Abs. 582   2003

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  • 希土類酸化物薄膜のゲート絶縁膜応用

    大見俊一郎

    STRJ WG3-FEP会議(第52回)   2003

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  • Low-Frequency Noise Characteristics of MISFET's with La_2_O_3_ Gate Dielectrics

    H.Sauddin, Y.Yoshihara, S.Ohmi, K.Tsutsui H.Iwai

    204^th^ ECS Meeting   Abs.564   2003

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  • Effect of Post Metallization Annealing for La_2_O_3_ Gate Thin Films on Electrical Characteristics

    A.Kuriyama, S.Ohmi, K.Tsutusi H.Iwai

    204^th^ ECS Meeting   Abs.564   2003

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  • Electrical Characteristics of High-K Stack Gate Dielectric Thin Films with La_2_O_3_ as Buffer Layer

    I.Ueda, S.Ohmi H.Iwai

    204^th^ ECS Meeting   Abs. 545   2003

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  • Electrical Characteristics of High-K Stack Gate Dielectric Thin Films with La_2_O_3_ as Buffer Layer

    I.Ueda, S.Ohmi H.Iwai

    204^th^ ECS Meeting   Abs. 545   2003

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  • Electrical Characteristics of High-k La_2_O_3_ Thin Film Deposited by E-Beam Evaporation Method

    Y.Kim S.Ohmi, K.Tsusui H.Iwai

    204^th^ ECS Meeting   Abs. 582   2003

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  • Low-Frequency Noise Characteristics of MISFET's with La_2_O_3_ Gate Dielectrics

    H.Sauddin, Y.Yoshihara, S.Ohmi, K.Tsutsui H.Iwai

    204^th^ ECS Meeting   Abs.564   2003

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  • Effect of Post Metallization Annealing for La_2_O_3_ Gate Thin Films on Electrical Characteristics

    A.Kuriyama, S.Ohmi, K.Tsutusi H.Iwai

    204^th^ ECS Meeting   Abs.564   2003

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  • ECRスパッタ法により形成したAlO_x_N_y_薄膜の熱処理に関する検討

    山中剛, 内川偉史, 大見俊一郎, 酒井徹志

    第64回応用物理学会学術講演会 講演予稿集   2   733   2003

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  • Si/SiGe/Si構造におけるSiGe選択エッチングに関する検討

    関川智英, 袴田佳孝, 山崎崇, 大見俊一郎, 酒井徹志

    第64回応用物理学会学術講演会 講演予稿集   2   770   2003

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  • SFC構造SiGe HBTの高周波特性の解析

    山崎崇, 高瀬恭英, 大見俊一郎, 酒井徹志

    第50回 応用物理学関係連合講演会 予稿集   2   967   2003

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  • SFC構造SiGe HBTにおけるp^+^poly-Siコンタクト領域作製プロセスの検討

    高瀬恭英, 山崎崇, 大見俊一郎, 酒井徹志

    第50回 応用物理学関係連合講演会 予稿集   2   967   2003

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  • ECRスパッタ法により形成したAlO_x_N_y_薄膜の電気特性に対する熱処理の効果

    山中剛, 佐々木大輔, 大見俊一郎, 酒井徹志

    第50回応用物理学関係連合講演会 講演予稿集   2   893   2003

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  • n^+^-poly-Siゲートを有する新構造Double-Gate MOSFETの特性解析

    世古裕亮, 大見俊一郎, 酒井徹志

    第64回応用物理学会学術講演会 講演予稿集   2   796   2003

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  • MBE 法により形成した高誘電率La_2_O_3_薄膜における電気特性

    金容湜, 大見俊一郎, 筒井一生, 岩井洋

    第50回応用物理学関係連合講演会   2   868   2003

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  • La_2_O_3_薄膜の電気特性におけるSi基板表面処理の効果

    吉原義昭, 大島千鶴, 大見俊一郎, 筒井一生, 岩井洋

    第50回応用物理学関係連合講演会   2   868   2003

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  • 希土類酸化物の結晶化におけるSi 基板面方位依存性

    金容湜, 柏木郁未, 大見俊一郎, 岩井洋

    第63回応用物理学会学術講演会講演予稿集   2   734   2003

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  • 高誘電率希土類酸化物薄膜のSi基板表面処理の効果

    吉原義昭, 大島千鶴, 大見俊一郎, 岩井洋

    第63回応用物理学会学術講演会講演予稿集   2   735   2003

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  • 新構造MOS/SOIの電気特性 -2Dシミュレーション-

    盛田伸也, 大理洋征龍, 山崎崇, 大見俊一郎, 酒井徹志

    第64回応用物理学会学術講演会 講演予稿集   2   795   2003

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  • In-situ アニールによるDy_2_O_3_薄膜の電気特性向上に関する検討

    山本浩之, 田口順一, 大見俊一郎, 石原宏 岩井洋

    第49回応用物理学会関係連合講演会 講演予稿集   2   836   2002

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  • 高誘電率薄膜の耐湿性に関する検討 -アクリル容器からの放出ガスの影響-

    赤間貞洋, 菊池明, 大見俊一郎, 岩井洋

    STARCシンポジウム2002   2002

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  • Dy_2_O_3_/Si(100)構造における電気特性のアニール条件依存性

    田口順一, 山本浩之, 大見俊一郎, 岩井洋

    STARCシンポジウム2002   2002

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  • 最先端CMOSデバイス・プロセス技術

    大見俊一郎

    第99回電子デバイス技術委員会   2002

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  • Si基板上に形成した高誘電率Gd_2_O_3_薄膜の電気特性

    大島千鶴, 柏木郁未, 大見俊一郎, 岩井洋

    STARCシンポジウム2002   2002

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  • GdO_x_/Si(100)およびLuO_x_/Si(100)界面遷移層の角度分解X線光電子分光解析

    白石貴義, 中村智裕, 吉田徹史, 高橋健介, 柏木郁未, 大島千鶴, 武田光弘, 野平博司, 大見俊一郎, 岩井洋, 服部健雄

    第63回応用物理学会学術講演会 講演予稿集   2   735   2002

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  • 微細シリコンデバイスに要求される各種高性能薄膜

    大見俊一郎, 岩井洋

    第63回応用物理学会学術講演会 応用物理学会論文賞受賞記念講演   0   10   2002

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  • 希土類酸化物上へのTaNゲート電極の形成

    上田功, 田口順一, 大見俊一郎, 岩井洋

    第63回応用物理学会学術講演会 講演予稿集   2   737   2002

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  • プラズマドーピングとプラズマ前処理を用いたガスドーピング

    檜垣良太, 赤間貞洋, 大見俊一郎, 筒井一生, 佐々木雄一朗, 水野文二, 岩井洋

    第63回応用物理学会学術講演会 講演予稿集   2   769   2002

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  • 希土類酸化物の結晶化におけるSi基板面方位依存性

    金容湜, 柏木郁未, 大見俊一郎, 岩井洋

    第63回応用物理学会学術講演会 講演予稿集   2   734   2002

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  • 高誘電率希土類酸化物薄膜のSi基板表面処理の効果

    吉原義昭, 大島千鶴, 大見俊一郎, 岩井洋

    第63回応用物理学会学術講演会 講演予稿集   2   735   2002

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  • Depth Profiling of High-K Dielectric/Si Interfacial Transition Layer

    T. Shiraishi, T. Nakamura, K. Takahashi, I. Kashiwagi, C. Ohshima, H. Nohira, S. Ohmi, H. Iwai, T. Hattori

    Extended Abstracts of the 2002 International Conference on Solid State Devices and Materials   758 - 759   2002

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  • Chemical and Electronic Structures of Lu_2_O_3_/Si Interfacial Transition Layer

    H. Nohira, T. Shiraishi, T. Nakamura, K. Takahashi, M. Takeda, S. Ohmi, H. Iwai, T. Hattori

    Fourth International Symposium on Control of Semiconductor Interfaces   4 - 5   2002

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  • Double-polysilicon self-aligned HBT with non-selective epitaxial SiGe:C base layer

    T. Yamazaki, S. Ohmi, M. Sakuraba, J. Murota, T. Sakai

    Second International Workshop on New Group IV (Si-Ge-C) Semiconductors: Control of Properties and Applications to Ultrahigh Speed and Opto-Electronic Devices   VIII-06   2002

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  • The Effect of In-situ Vacuum Anneal for High-Dielectric Dy_2_O_3_ Thin Films

    Hiroyuki Yamamoto Junichi, Taguchi Shun-ichiro Ohmi Hiroshi Iwai

    WORKSHOP ON MICROELECTRONICS AND ELECTRON DEVICES (μE-ED 2002)   17 - 18   2002

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  • Effect of Surface Treatment of Si substrates and Annealing Condition on High-k Rare Earth Oxide Gate Dielectrics

    C. Ohshima, J. Taguchi, I. Kashiwagi, H. Yamamoto, S. Ohmi, H. Iwai

    Fourth International Symposium on Control of Semiconductor Interfaces   2 - 12   2002

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  • High-k Gate Insulator Endurance against Moisture Ambience and Wet Process

    A. Kikuchi, S. Akama, S. Ohmi, K. Tsutsui, H. Iwai

    WORKSHOP ON MICROELECTRONICS AND ELECTRON DEVICES (μE-ED 2002)   13 - 14   2002

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  • Dependence of Gd_2_O_3_ thin film properties on Si substrate orientation

    Ikumi Kashiwagi Chizuru Ohshima Yongshik Kim Shun-ichiro Ohmi Kazuo Tsutsui, Hiroshi Iwai

    WORKSHOP ON MICROELECTRONICS AND ELECTRON DEVICES (μE-ED 2002)   15 - 16   2002

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  • Characteristics of High-k Gd_2_O_3_ films deposited on different orientation of Si substrate

    I. Kashiwagi, C. Ohshima, S.-I. Ohmi, H. Iwai

    202nd meeting of The Electrochemical Society   2002

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  • Electrical Characterisitics Improvement of Dy_2_O_3_ Thin Films by In-situ Vacuum Anneal

    H. Yamamoto, J. Taguchi, S. -I. Ohmi, H. Iwai

    202^nd^ meeting of The Electrochemical Society   375   2002

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  • Stability of High-k Thin Films for Wet Process

    A. Kikuchi, S. Akama, S, I. Ohmi, H. Iwai

    202nd meeting of The Electrochemical Society   2002

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  • Stability of High-k Thin Films for Wet Process

    A. Kikuchi, S. Akama, S, I. Ohmi, H. Iwai

    202nd meeting of The Electrochemical Society   2002

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  • Characteristics of High-k Gd_2_O_3_ films deposited on different orientation of Si substrate

    I. Kashiwagi, C. Ohshima, S.-I. Ohmi, H. Iwai

    202nd meeting of The Electrochemical Society   2002

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  • Electrical characteristics of Gd2O3 thin film deposited on si substrate

    Chizuru Ohshima, Ikumi Kashiwagi, Shun-Ichiro Ohmi, Hiroshi Iwai

    European Solid-State Device Research Conference   415 - 418   2002

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    Gadolinium oxide (Gd2O3) for high-k gate dielectric films were deposited on n-Si(100) substrates by e-beam evaporation to investigate their electrical characteristics. The electrical characteristics of Gd2O3 films were evaluated by fabricating Metal-Oxide-Semiconductor (MOS) capacitors. Gd2O3 thin films were confirmed amorphous after post deposition anneal in oxygen ambient at 400°C for 5min by XRD measurement. Formation of chemical oxide on Si substrate before the deposition of the Gd2O3 films improved the electrical characteristics and surface roughness.

    DOI: 10.1109/ESSDERC.2002.194956

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  • Annealing condition dependence of electrical characteristics for Dy2O3/Si(100) structures

    Junichi Taguchi, Hiroyuki Yamamoto, Junichi Tonotani, Shun-Ichiro Ohmi, Hiroshi Iwai

    European Solid-State Device Research Conference   591 - 594   2002

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    In this paper, we report on the annealing condition dependence of electrical characteristics for Dy2O3 thin films deposited by MBE. Low temperature long time anneal decreased leakage current density with little interfacial layer growth. Excellent improvements of electrical characteristics and interfacial properties were confirmed.

    DOI: 10.1109/ESSDERC.2002.195000

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  • Electrical Characteristics of Rare Earth Gate Oxides Improved by Chemical Oxide and Long Low Temperature Annealing

    S.Ohmi I.Kashiwagi, C.Ohshima, J.Taguchi, H.Yamamoto, J.Tonotani, H.Ishiwara H.Iwai

    Extended Abstracts of the 2002 International Conference on Solid State Devices and Materials   718 - 719   2002

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  • Stability of High-k thin films in moisture ambience - The effect of dissolution gas from acryl apparatus

    Sadahiro Akama, Akira Kikuchi, Junichi Tonotani, Shun-Ichiro Ohmi, Hiroshi Iwai

    European Solid-State Device Research Conference   587 - 590   2002

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    High-k thin films were deposited on Si substrates by using MBD system equipped with electron beam evaporators. Then, the moisture absorption test was carried out for these samples. The effect of dissolution gas from the moisture absorption test apparatus was investigated by comparing the results with apparatus made of acryl and glass. The films in case of using acryl apparatus were dramatically degraded.

    DOI: 10.1109/ESSDERC.2002.194999

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  • Rare Earth Metal Oxides for High-k Gate Insulator

    S.Ohmi S.Akama, A.Kikuchi, I.Kashiwagi, C.Ohshima, J.Taguchi, H.Yamamoto, K.Sato, M.Takeda, H.Ishiwara, H.Iwai

    Electrochemical Society Proceedings Volume 2002-2   376 - 387   2002

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  • Characterization of Lu_2_O_3_ High-k Thin Films on Si(100) Fabricated by E-beam Deposition Method

    S.Ohmi M.Takeda, H.Ishiwara, H. Iwai

    ECS International Semiconductor Technology Conference 2002   Abstract No.59   2002

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  • ECRスパッタ法により形成したAlO_x_N_y_薄膜の電気特性

    山中剛, 佐々木大輔, 大見俊一郎, 酒井徹志

    第63回応用物理学関係連合講演会 講演予稿集   2   745   2002

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  • Characterization of Lu_2_O_3_ Thin Films Fabricated by E-beam Deposition Method

    S. Ohmi M. Takeda, H. Ishiwara, H. Iwai

    Proc. 2nd Int. Conf. Semicond. Technol.   PV 2002-17   251 - 261   2002

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  • Depth Profiling of High-K Dielectric/Si Interfacial Transition Layer

    T. Shiraishi, T. Nakamura, K. Takahashi, I. Kashiwagi, C. Ohshima, H. Nohira, S. Ohmi, H. Iwai, T. Hattori

    Extended Abstracts of the 2002 International Conference on Solid State Devices and Materials   758 - 759   2002

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  • Characterization of Lu_2_O_3_ Thin Films Fabricated by E-beam Deposition Method

    S. Ohmi M. Takeda, H. Ishiwara, H. Iwai

    Proc. 2nd Int. Conf. Semicond. Technol.   PV 2002-17   251 - 261   2002

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  • Chemical and Electronic Structures of Lu_2_O_3_/Si Interfacial Transition Layer

    H. Nohira, T. Shiraishi, T. Nakamura, K. Takahashi, M. Takeda, S. Ohmi, H. Iwai, T. Hattori

    Fourth International Symposium on Control of Semiconductor Interfaces   4 - 5   2002

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  • Double-polysilicon self-aligned HBT with non-selective epitaxial SiGe:C base layer

    T. Yamazaki, S. Ohmi, M. Sakuraba, J. Murota, T. Sakai

    Second International Workshop on New Group IV (Si-Ge-C) Semiconductors: Control of Properties and Applications to Ultrahigh Speed and Opto-Electronic Devices   VIII-06   2002

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  • The Effect of In-situ Vacuum Anneal for High-Dielectric Dy_2_O_3_ Thin Films

    Hiroyuki Yamamoto Junichi, Taguchi Shun-ichiro Ohmi Hiroshi Iwai

    WORKSHOP ON MICROELECTRONICS AND ELECTRON DEVICES (μE-ED 2002)   17 - 18   2002

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  • Effect of Surface Treatment of Si substrates and Annealing Condition on High-k Rare Earth Oxide Gate Dielectrics

    C. Ohshima, J. Taguchi, I. Kashiwagi, H. Yamamoto, S. Ohmi, H. Iwai

    Fourth International Symposium on Control of Semiconductor Interfaces   2 - 12   2002

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  • High-k Gate Insulator Endurance against Moisture Ambience and Wet Process

    A. Kikuchi, S. Akama, S. Ohmi, K. Tsutsui, H. Iwai

    WORKSHOP ON MICROELECTRONICS AND ELECTRON DEVICES (μE-ED 2002)   13 - 14   2002

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  • Dependence of Gd_2_O_3_ thin film properties on Si substrate orientation

    Ikumi Kashiwagi Chizuru Ohshima Yongshik Kim Shun-ichiro Ohmi Kazuo Tsutsui, Hiroshi Iwai

    WORKSHOP ON MICROELECTRONICS AND ELECTRON DEVICES (μE-ED 2002)   15 - 16   2002

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  • Electrical Characterisitics Improvement of Dy_2_O_3_ Thin Films by In-situ Vacuum Anneal

    H. Yamamoto, J. Taguchi, S. -I. Ohmi, H. Iwai

    202^nd^ meeting of The Electrochemical Society   375   2002

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  • 希土類酸化物薄膜の電気特性におけるSi基板面方位依存性

    柏木郁未, 大島千鶴, 大見俊一郎, 石原宏 岩井洋

    第49回応用物理学会関係連合講演会 講演予稿集   2   796   2002

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  • Dy_2_O_3_/Si(100)構造の電気特性のアニール時間依存性

    田口順一, 山本浩之, 戸野谷純一, 大見俊一郎, 石原宏 岩井洋

    第49回応用物理学会関係連合講演会 講演予稿集   2   835   2002

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  • Si基板上への高誘電率Pr_2_O_3_薄膜の形成条件に関する検討

    佐藤航一郎, 大見俊一郎, 石原宏 岩井洋

    第49回応用物理学関係連合講演会 講演予稿集   2   795   2002

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  • 高誘電率希土類酸化物薄膜の耐湿性に関する検討 -アクリル容器からの放出ガスの影響-

    赤間貞洋, 菊池明, 戸野谷純一, 大見俊一郎, 石原宏 岩井洋

    第49回応用物理学会関係連合講演会 講演予稿集   2   795   2002

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  • Characterization of Lu_2_O_3_ High-k Thin Films on Si(100) Fabricated by E-beam Deposition Method

    S.Ohmi M.Takeda, H.Ishiwara, H. Iwai

    ECS International Semiconductor Technology Conference 2002   Abstract No.59   2002

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  • Electrical Characteristics of Rare Earth Gate Oxides Improved by Chemical Oxide and Long Low Temperature Annealing

    S.Ohmi I.Kashiwagi, C.Ohshima, J.Taguchi, H.Yamamoto, J.Tonotani, H.Ishiwara H.Iwai

    Extended Abstracts of the 2002 International Conference on Solid State Devices and Materials   718 - 719   2002

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  • Rare Earth Metal Oxides for High-k Gate Insulator

    S.Ohmi S.Akama, A.Kikuchi, I.Kashiwagi, C.Ohshima, J.Taguchi, H.Yamamoto, K.Sato, M.Takeda, H.Ishiwara, H.Iwai

    Electrochemical Society Proceedings Volume 2002-2   376 - 387   2002

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  • 希土類酸化物薄膜におけるin-situ真空アニールの効果に関する検討

    栗山篤, 山本浩之, 大見俊一郎, 岩井洋

    第63回応用物理学会学術講演会 講演予稿集   2   734   2002

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  • Sub-20nm新構造Double-Gate MOSFET

    奥田慶文, 大見俊一郎, 酒井徹志

    第49回応用物理学会関係連合講演会 講演予稿集   2   890   2002

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  • Pイオン注入による非晶質Si薄膜の増速エッチングとその応用

    山崎崇, 大見俊一郎, 室田淳一, 酒井徹志

    第49回応用物理学会関係連合講演会 講演予稿集   2   859   2002

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  • High-kゲート絶縁膜のRIE特性

    戸野谷純一, 赤間貞洋, 菊池明, 大見俊一郎, 岩井洋

    第49回応用物理学会関係連合講演会 講演予稿集   2   837   2002

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  • ECRスパッタ法により形成したAlN薄膜へのAr/O_2_プラズマ照射の効果

    安西邦夫, 佐々木大輔, 大見俊一郎, 酒井徹志

    第49回応用物理学会関係連合講演会 講演予稿集   2   834   2002

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  • Lu_2_O_3_薄膜形成における基板表面処理の効果

    武田光弘, 大見俊一郎, 石原宏 岩井洋

    第49回応用物理学会関係連合講演会 講演予稿集   2   837   2002

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  • GdO_x_およびLuO_x_の極薄膜確度分解X線光電子分光分析

    中村智裕, 白石貴義, 高橋健介, 柏木郁未, 大島千鶴, 武田光弘, 野平博司, 大見俊一郎, 岩井洋, 服部健雄

    第49回応用物理学会関係連合講演会 講演予稿集   2   837   2002

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  • Si基板上に形成した高誘電率 Gd_2_O_3_薄膜の電気特性

    大島千鶴, 柏木郁未, 大見俊一郎, 石原宏 岩井洋

    第49回応用物理学会関係連合講演会 講演予稿集   2   836   2002

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  • 希土類酸化物薄膜のウェットプロセス耐性

    菊地明, 赤間貞洋, 戸野谷純一, 大見俊一郎, 石原宏 岩井洋

    第49回応用物理学会関係連合講演会 講演予稿集   2   836   2002

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  • アメリカを中心とするゲート絶縁膜用High-k材料の最新技術動向

    大見俊一郎

    Material Stage   1 ( 2 )   1 - 11   2001

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    Language:Japanese   Publisher:技術情報協会  

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  • High-kゲート絶縁膜用希土類酸化物薄膜の電気特性

    柏木郁未, 大島千鶴, 佐藤航一郎, 武田光弘, 大島享介, 大見俊一郎, 石原宏 岩井洋

    STARCシンポジウム2001   2001

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  • 高誘電率希土類酸化物のSi基板上への形成

    田口順一, 山本浩之, 佐藤航一郎, 武田光弘, 大島享介, 大見俊一郎, 石原宏 岩井洋

    第62回応用物理学会学術講演会   2   2001

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  • Gate dielectrics for deep sub-0.1 μm CMOS

    H. Iwai, S. Ohmi

    FTM 2001, Scientific Program, 2001 Advanced Research Workshop, Future Trends in Microelectronics: The Nano Millennium   45   2001

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  • ULSI Process Integration for 2005 and beyond

    H. Iwai, S. Ohmi

    The 199th Meeting of The Electrochemical Society, ULSI Process Integration II   2001-2   3 - 33   2001

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  • Enhanced short-channel effects of sub-50nm gate length MOSFETs with high-k gate insulator films

    R.Fujimura, M.Takeda, K.Sato, S.Ohmi, H.Ishiwara, H.Iwai

    The 199th Meeting of The Electrochemical Society ULSI Process Integration II   2001-2   313 - 323   2001

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  • Rare earth metal oxide gate thin films prepared by e-beam deposition

    S. Ohmi, S. Akama, A. Kikuchi, I. Kashiwagi, C. Ohshima, J. Taguchi, H. Yamamoto, C. Kobayashi, K. Sato, A. Takeda, K. Oshima, H. Ishiwara, H. Iwai

    Extended Abstracts of International Workshop on Gate Insulator, IWGI 2001   200 - 204   2001

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    Language:English   Publisher:Institute of Electrical and Electronics Engineers Inc.  

    In this paper, we report the results of the examination of various rare earth oxides for future CMOS gate insulator applications. The electrical and physical characteristics of various rare earth metal oxides have been investigated. Most of the rare earth metal oxides showed excellent electrical properties and smooth surface especially, La2O3. Other materials such as Dy2O3 and Lu2O3 showed good electrical characteristics in terms of frequency dependence, however, it was found that it is necessary to obtain the optimum process conditions (deposition temperature, RTA temperature, RTA ambient etc.) for each rare earth oxide material.

    DOI: 10.1109/IWGI.2001.967583

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  • High quality ultrathin La2O3 films for high-k gate insulator

    Shun-Ichiro Ohmi, Chihiro Kobayashi, Koji Aizawa, Shuu'ichirou Yamamoto, Eisuke Tokumitsu, Hiroshi Ishiwara, Hiroshi Iwai

    European Solid-State Device Research Conference   235 - 238   2001

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    Language:English   Publisher:IEEE Computer Society  

    Properties of amorphous Lanthanum oxide (La2O3) film deposited by e-beam evaporation were investigated by fabricating MIS capacitors. Equivalent oxide thicknesses of 0.8 - 1.2 nm were successfully obtained. It was found that the surface morphology of La2O3 thin films is greatly improved by increasing the deposition temperature. The leakage current density was dramatically reduced by post deposition anneal at 400 - 600°C. The leakage currents, for example, were as small as 5.5 x 10-4 A/cm2 @ EOT=0.88 nm, and 1.7 x 10-8 A/cm2 @ EOT=1.26 nm, both at Vg=1 V, for n-type Si substrate MIS capacitors.

    DOI: 10.1109/ESSDERC.2001.195244

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  • Low Leakage La┣D22┫D2O┣D23┫D2 Gate Insulator Film with EOTs of 0.8-1.2 nm

    S.Ohmi C. Kobayashi, E. Tokumitsu, H. Ishiwara, H.Iwai

    2001 International Conference on Solid State Devices and Conferences   496 - 497   2001

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  • 高誘電率Pr_2_O_3_薄膜の形成条件に関する検討

    佐藤航一郎, 大見俊一郎, 石原宏 岩井洋

    第62回応用物理学会学術講演会   2   2001

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  • Gate dielectrics for deep sub-0.1 μm CMOS

    H. Iwai, S. Ohmi

    FTM 2001, Scientific Program, 2001 Advanced Research Workshop, Future Trends in Microelectronics: The Nano Millennium   45   2001

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  • High quality ultrathin La2O3 films for high-k gate insulator

    Shun-Ichiro Ohmi, Chihiro Kobayashi, Koji Aizawa, Shuu'ichirou Yamamoto, Eisuke Tokumitsu, Hiroshi Ishiwara, Hiroshi Iwai

    European Solid-State Device Research Conference   235 - 238   2001

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    Language:English   Publisher:IEEE Computer Society  

    Properties of amorphous Lanthanum oxide (La2O3) film deposited by e-beam evaporation were investigated by fabricating MIS capacitors. Equivalent oxide thicknesses of 0.8 - 1.2 nm were successfully obtained. It was found that the surface morphology of La2O3 thin films is greatly improved by increasing the deposition temperature. The leakage current density was dramatically reduced by post deposition anneal at 400 - 600°C. The leakage currents, for example, were as small as 5.5 x 10-4 A/cm2 @ EOT=0.88 nm, and 1.7 x 10-8 A/cm2 @ EOT=1.26 nm, both at Vg=1 V, for n-type Si substrate MIS capacitors.

    DOI: 10.1109/ESSDERC.2001.195244

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  • ULSI Process Integration for 2005 and beyond

    H. Iwai, S. Ohmi

    The 199th Meeting of The Electrochemical Society, ULSI Process Integration II   2001-2   3 - 33   2001

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  • Enhanced short-channel effects of sub-50nm gate length MOSFETs with high-k gate insulator films

    R.Fujimura, M.Takeda, K.Sato, S.Ohmi, H.Ishiwara, H.Iwai

    The 199th Meeting of The Electrochemical Society ULSI Process Integration II   2001-2   313 - 323   2001

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  • NiSi Salicide Technology for Scaled CMOS

    H. Iwai, T. Ohguro, S. Ohmi

    Abstract of European Workshop Materials for Advanced Metallization (MAM2001)   O7.5   2001

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  • シミュレーションによる極微細高誘電率ゲートFETの電気特性解析

    藤村亮介, 武田光弘, 大見俊一郎, 石原宏 岩井洋

    第48回応用物理学関係連合講演会   2   2001

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  • high-kゲート絶縁膜技術の最新研究動向と将来展望

    岩井洋, 大見俊一郎

    Semiconductor FPD World   20 ( 12 )   39 - 51   2001

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  • RPECVD法によるAl_2_O_3_のSi基板上への形成

    大見俊一郎, R.S.Johnson, J.G.Hong, G.Lucovsky 岩井洋

    第48回応用物理学関係連合講演会   2   2001

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  • Low Leakage La┣D22┫D2O┣D23┫D2 Gate Insulator Film with EOTs of 0.8-1.2 nm

    S.Ohmi C. Kobayashi, E. Tokumitsu, H. Ishiwara, H.Iwai

    2001 International Conference on Solid State Devices and Conferences   496 - 497   2001

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  • アメリカを中心とするゲート絶縁膜用High-k材料の最新技術動向

    大見俊一郎, 岩井洋

    Material Stage   1 ( 2 )   1 - 11   2001

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  • 次世代ゲート絶縁膜用高誘電率薄膜に関する研究

    岩井洋, 大見俊一郎

    日本学術振興会 未来開拓学術研究推進事業 研究プロジェクト、「次世代ULSI用薄膜材料の開発とナノスケールプロセスインテグレーション」第8回研究会   2001

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  • 高誘電体ゲート絶縁膜技術

    岩井洋, 大見俊一郎

    半導体・集積回路技術第60回シンポジウム   6 - 11   2001

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  • 電子ビーム蒸着法によるLa_2_O_3_薄膜のSi基板上への形成

    小林千尋, 大見俊一郎, 徳光永輔, 石原宏, 岩井洋

    第48回応用物理学関係連合講演会   2   2001

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  • 微細CMOSにおける1/f雑音のゲート長依存性

    芦田光行, 大見俊一郎, 大黒達也, 岩井洋

    第48回応用物理学関係連合講演会   2   2001

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  • 超高真空電子ビーム蒸着法により堆積した高誘電率材料ZrO_2_膜の特性

    大島享介, 大見俊一郎, 徳光永輔, 岩井洋, 石原宏

    第48回応用物理学関係連合講演会   2   2001

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  • 電子ビーム蒸着法によりSi基板上に堆積したPr酸化物の特性

    佐藤航一郎, 大見俊一郎, 徳光永輔, 石原宏, 岩井洋

    第48回応用物理学関係連合講演会   2   2001

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  • 電子ビーム蒸着法による高誘電率Lu_2_O_3_薄膜の形成

    武田光弘, 佐藤航一郎, 大見俊一郎, 石原宏 岩井洋

    第62回応用物理学会学術講演会   2   2001

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  • 高誘電率希土類酸化物薄膜の耐湿性に関する検討

    赤間貞洋, 菊地明, 佐藤航一郎, 武田光弘, 大島享介, 大見俊一郎, 石原宏 岩井洋

    第62回応用物理学会学術講演会   2   2001

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  • 電子ビーム蒸着法によるZrO_2_薄膜形成時における酸素導入の効果

    大島享介, 大見俊一郎, 朴炳垠, 石原宏, 岩井洋

    第62回応用物理学会学術講演会   2   2001

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  • High-kゲート絶縁膜用希土類酸化物薄膜の電気特性

    大島千鶴, 柏木郁未, 佐藤航一郎, 武田光弘, 大島享介, 大見俊一郎, 石原宏 岩井洋

    第62回応用物理学会学術講演会   2   2001

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  • High-kゲート絶縁膜用酸化物材料の研究

    徳光永輔, 大見俊一郎, 岩井洋

    電気学会電子材料研究会   EFM-01 ( 12 )   37 - 41   2001

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  • NiSi Salicide Technology for Scaled CMOS

    H. Iwai, T. Ohguro, S. Ohmi

    Abstract of European Workshop Materials for Advanced Metallization (MAM2001)   O7.5   2001

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  • 高誘電率希土類酸化物のSi基板上への形成

    山本浩之, 田口順一, 佐藤航一郎, 武田光弘, 大島享介, 大見俊一郎, 石原宏 岩井洋

    STARCシンポジウム2001   2001

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  • 高誘電率希土類酸化物薄膜の耐湿性に関する検討

    菊地明, 赤間貞洋, 佐藤航一郎, 武田光弘, 大島享介, 大見俊一郎, 石原宏 岩井洋

    STARCシンポジウム2001   2001

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  • Epitaxial silicide interfaces in microelectronics

    RT Tung, S Ohmi

    THIN SOLID FILMS   369 ( 1-2 )   233 - 239   2000.7

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    The need for low-resistance, shallow contacts in Si-based microelectronic devices has driven the search for fabrication techniques of epitaxial silicides which are compatible with the manufacturing environment. For ultra large scale integration (ULSI) applications, techniques such as high temperature sputtering (HTS). Ti-interlayer mediated epitaxy (TIME), and oxide mediated epitaxy (OME) have shown varied degrees of success, and also problems. In this paper, a number of modifications aimed at simplifying the OME technique will be presented. New experimental results regarding HTS on sloped Si surfaces will also be described which suggest possible improvement to the HTS technique. (C) 2000 Elsevier Science S.A. All rights reserved.

    DOI: 10.1016/S0040-6090(00)00814-2

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  • Ultra-thin gate SiO┣D22┫D2 technology

    SHUN-ICHIRO OHMI

    THE PHYSICS AND CHEMISTRY OF SiO┣D22┫D2 AND THE Si-SiO┣D22┫D2 INTERFACE-4   PV2000 ( 2 )   3 - 18   2000

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  • 微細シリコンデバイスに要求される各種高性能薄膜

    大見俊一郎

    応用物理学会誌   69 ( 1 )   4 - 14   2000

  • Semiconductor Devices for the 21th Century and Lithography Technology

    IWAI Hiroshi, OHMI Shun-ichiro

    IEEJ Transactions on Sensors and Micromachines   120 ( 6 )   340 - 343   2000

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    Language:Japanese   Publisher:The Institute of Electrical Engineers of Japan  

    DOI: 10.1541/ieejjournal.120.340

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    Other Link: https://jlc.jst.go.jp/DN/JALC/00067139316?from=CiNii

  • Ultra-thin gate SiO┣D22┫D2 technology

    SHUN-ICHIRO OHMI

    THE PHYSICS AND CHEMISTRY OF SiO┣D22┫D2 AND THE Si-SiO┣D22┫D2 INTERFACE-4   PV2000 ( 2 )   3 - 18   2000

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  • High-kゲート絶縁膜の動向

    大見俊一郎, 岩井洋

    Challenge of Intelligence for Future Break Through   171 ( 10 )   7 - 11   2000

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  • マイクロ波Si系素子・回路の技術動向および今後の展望について

    大見俊一郎

    電子情報通信学会論文誌   83 ( 10 )   911 - 919   2000

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  • 微細シリコンデバイスに要求される各種高性能薄膜

    岩井洋, 大見俊一郎

    応用物理   69 ( 1 )   4 - 14   2000

  • Effect of ultrathin Mo and MoSi┣D2X┫D2 layer on Ti silicide reaction

    SHUN-ICHIRO OHMI

    J. Appl. Phys.   86 ( 7 )   3655 - 3660   1999

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  • Facilitated C54-TiSi┣D22┫D2 Formation with Elevated Deposition Temperature: A Study of Co-deposited Layers

    S. Ohmi, R. T. Tung

    Mat. Res. Soc. Symp. Proc.   564   47 - 52   1999

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  • OXIDE MEDIATED EPITAXIAL GROWTH OF CoSi┣D22┫D2 IN A SINGLE DEPOSITION STEP

    S. Ohmi, R. T. Tung

    Mat. Res. Soc. Symp. Proc.   564   117 - 122   1999

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  • Silicide Formation in Co-Deposited TiSi┣D2X┫D2 Layers: The Effect of Deposition Temperature and Mo

    SHUN-ICHIRO OHMI

    J. Electronic Materials   28 ( 10 )   1115 - 1122   1999

  • Effect of ultrathin Mo and MoSi┣D2X┫D2 layer on Ti silicide reaction

    SHUN-ICHIRO OHMI

    J. Appl. Phys.   86 ( 7 )   3655 - 3660   1999

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  • Facilitated C54-TiSi┣D22┫D2 Formation with Elevated Deposition Temperature: A Study of Co-deposited Layers

    S. Ohmi, R. T. Tung

    Mat. Res. Soc. Symp. Proc.   564   47 - 52   1999

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  • OXIDE MEDIATED EPITAXIAL GROWTH OF CoSi┣D22┫D2 IN A SINGLE DEPOSITION STEP

    S. Ohmi, R. T. Tung

    Mat. Res. Soc. Symp. Proc.   564   117 - 122   1999

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  • Silicide Formation in Co-Deposited TiSi┣D2X┫D2 Layers: The Effect of Deposition Temperature and Mo

    SHUN-ICHIRO OHMI

    J. Electronic Materials   28 ( 10 )   1115 - 1122   1999

  • Oxide Mediated Epitaxy on Planar and Non-planar Silicon

    SHUN-ICHIRO OHMI

    Mat. Res. Soc. Symp. Proc.   514   427 - 432   1998

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  • Oxide Mediated Epitaxy on Planar and Non-planar Silicon

    SHUN-ICHIRO OHMI

    Mat. Res. Soc. Symp. Proc.   514   427 - 432   1998

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  • Improved Thermal Stability of Ultra-thin CoSi┣D22┫D2 layers by Oxygen Annealing

    SHUN-ICHIRO OHMI

    Mat. Res. Soc. Symp. Proc.   514   157 - 162   1998

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  • Improved Thermal Stability of Ultra-thin CoSi┣D22┫D2 layers by Oxygen Annealing

    SHUN-ICHIRO OHMI

    Mat. Res. Soc. Symp. Proc.   514   157 - 162   1998

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  • Electrical properties of ferroelectric BaMgF┣D24┫D2 films grown on GaAs substrates using AlGaAs buffer layer

    Tomoki Hayashi, Makoto Yoshihara Syun-ichiro, Ohmi Eisuke Tokuitsu, Hiroshi Ishiwara

    Applied Surface Science   117/118   418 - 422   1997

  • Electrical properties of ferroelectric BaMgF┣D24┫D2 films grown on GaAs substrates using AlGaAs buffer layer

    Tomoki Hayashi, Makoto Yoshihara Syun-ichiro, Ohmi Eisuke Tokuitsu, Hiroshi Ishiwara

    Applied Surface Science   117/118   418 - 422   1997

  • Electrical Properties of Ferroelectric Gate HEMT Structures

    SHUN-ICHIRO OHMI

    Japanese Journal of Applied Physics   35 ( 2B )   1254 - 1257   1996

  • Ferroelectric Gate High Electron Mobility Transistors for Neural Computation

    Hiroshi Ishiwara Shun-ichiro, Ohmi Eisuke Tokumithu

    Proceedings of the International Conference on Quantum Devices and Circuits   262 - 267   1996

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  • Device characterization of high-electron-mobility transistors with ferroelectric-gate structures

    S Ohmi, T Okamoto, M Tagami, E Tokumitsu, H Ishiwara

    GAAS IC SYMPOSIUM - 18TH ANNUAL, TECHNICAL DIGEST 1996   163 - 166   1996

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    Fabrications and characterizations of high-electron-mobility transistors (HFMTs) with a ferroelectric gate (F-HEMTs) are presented. The F-HEMT is a memory device whose threshold voltage can be changed even after it is fabricated, by using remanent polarization of the ferroelectric gate. Furthermore, the F-HEMT is promising of neural network applications, because it can act as a high-speed analog memory which stores synaptic weights in a neuron circuit. From I-D-V-G characteristic measurements of F-HEMTs, it is demonstrated that the threshold voltage is shifted by 0.3 V by remanent polarization. The result indicates that F-HEMTs are sufficiently applicable for the high-speed analog memory.

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  • Ferroelectric Gate High Electron Mobility Transistors for Neural Computation

    Hiroshi Ishiwara Shun-ichiro, Ohmi Eisuke Tokumithu

    Proceedings of the International Conference on Quantum Devices and Circuits   262 - 267   1996

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  • Electrical Properties of Ferroelectric Gate HEMT Structures

    SHUN-ICHIRO OHMI

    Japanese Journal of Applied Physics   35 ( 2B )   1254 - 1257   1996

  • CHARACTERIZATION OF FERROELECTRIC BAMGF4 FILMS GROWN ON ALGAAS/GAAS(100) HIGH-ELECTRON-MOBILITY TRANSISTOR STRUCTURES

    SI OHMI, E TOKUMITSU, H ISHIWARA

    JOURNAL OF CRYSTAL GROWTH   150 ( 1-4 )   1104 - 1107   1995.5

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    Ferroelectric BaMgF4 films have been grown on AlGaAs/GaAs(100) high-electron-mobility transistor (HEMT) structures. BaMgF4 films in which the direction of spontaneous polarization has a finite angle to the substrate surface can be obtained on the HEMT structure at growth temperatures of 500-600 degrees C, However, it is shown that the growth temperature is limited to about 550 degrees C, because the AlGaAs/GaAs interface becomes disordered by the diffusion of Mg atoms into the HEMT structure when the growth temperature is 600 degrees C.

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  • Electrical Properties of Ferroelectric Gate HEMT structures

    SHUN-ICHIRO OHMI

    1995 International Conference on Solid State Devices and Materials   1995

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  • Contactless Measurement of Electron Mobility in Ferroelectric Gate High-Electron-Mobility Transistor Structures

    SHUN-ICHIRO OHMI

    Japanese Journal of Applied Physics   34 ( 5B )   L603 - L605   1995

  • Characterization of ferroelectric BaMgF4 films grown on AlGaAs/GaAs (100) high-electron-mobility transistor structures

    Shun-ichiro Ohmi, Eisuke Tokumitsu, Hiroshi Ishiwara

    Journal of Crystal Growth   150   1104 - 1107   1995

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  • Characterization of Ferroelectric BaMgF┣D24┫D2 Films Grown on AlGaAs/GaAs (100) High-Electron-Mobility Transistor Structures.

    SHUN-ICHIRO OHMI

    Journal of Crystal Growth   150 ( 1-4 )   1104 - 1107   1995

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  • Electrical Properties of Ferroelectric BaMgF┣D24┫D2 Films Grown on Modulation-Doped AlGaAs/GaAs (100) structures

    SHUN-ICHIRO OHMI

    1995 Electronic Materials Conference   1995

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  • Electrical Properties of Ferroelectric Gate HEMT structures

    SHUN-ICHIRO OHMI

    1995 International Conference on Solid State Devices and Materials   1995

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  • Characterization of Ferroelectric BaMgF┣D24┫D2 Films Grown on AlGaAs/GaAs (100) High-Electron-Mobility Transistor Structures.

    SHUN-ICHIRO OHMI

    Journal of Crystal Growth   150 ( 1-4 )   1104 - 1107   1995

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  • Contactless Measurement of Electron Mobility in Ferroelectric Gate High-Electron-Mobility Transistor Structures

    SHUN-ICHIRO OHMI

    Japanese Journal of Applied Physics   34 ( 5B )   L603 - L605   1995

  • Electrical Properties of Ferroelectric BaMgF┣D24┫D2 Films Grown on Modulation-Doped AlGaAs/GaAs (100) structures

    SHUN-ICHIRO OHMI

    1995 Electronic Materials Conference   1995

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  • ヘテロ成長におけるローテーショナル・ツイン生成機構の解明とその制御(共著)

    筒井一生, 大見俊一郎, 川崎宏治, 古川静二郎, N.S.ソコロフ

    日本結晶成長学会誌   21 ( 5 )   S177-S184   1994

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  • Study of epitaxial growth of rotational-twin-free CaF2Films on si(111)

    Shun-Ichiro Ohmi, Kazuo Tsutsui, Seijiro Furukawa

    Japanese Journal of Applied Physics   33 ( 2 R )   1121 - 1125   1994

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    It was shown that the 2-step growth method is very effective for growing rotational-twin-free CaF2films on Si(111) which is called type-A. Experimental study of the effect of thickness of the first layer in the 2-step growth method revealed the thickness of a first grown layer more than about 8 monolayers (ML) was necessary to obtain uniform type-A CaF2films, and that mixed or uniform type-B CaF2if it is less than 4 ML. A growth model in which the 1st layer must be rotated around the normal axis of Si(111) during the substrate temperature elevation just before the 2nd step growth if the 1st layer is less than 4 ML is proposed. © 1994 The Japanese Journal of Applied Physics.

    DOI: 10.1143/JJAP.33.1121

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  • Generation Mechanism and Control of Rotational Twin on Heteroepitaxial Growth

    Japanese Jourual of Crystal Growth   21 ( 5 )   S177-S184   1994

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  • Characterization of Ferroelectric BaMgF┣D24┫D2 Films on AlGaAs/GaAs (100) HEMT structures.

    SHUN-ICHIRO OHMI

    8th International Conference on Molecular Beam Epitaxy   1994

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  • ヘテロ成長におけるローテーショナル・ツイン生成機構の解明とその制御

    大見俊一郎

    日本結晶成長学会誌   21 ( 5 )   S177-S183   1994

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  • Sm┣D12+┫D1 Photoluminescence and X-ray Scattering studies of A-and B-Type Epitaxial CaF┣D22┫D2 Layers on Si (111)

    SHUN-ICHIRO OHMI

    Japanese Journal of Applied Physics   33 ( 4B )   2395 - 2400   1994

  • Characterization of Ferroelectric BaMgF┣D24┫D2 Films on AlGaAs/GaAs (100) HEMT structures.

    SHUN-ICHIRO OHMI

    8th International Conference on Molecular Beam Epitaxy   1994

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  • Study of Epitaxial Growth of Rotational Twin-Free CaF┣D22┫D2 Films on Si(111)

    SHUN-ICHIRO OHMI

    Japanese Journal of Applied Physics   33 ( 2 )   1121 - 1125   1994

  • Sm┣D12+┫D1 Photoluminescence and X-ray Scattering studies of A-and B-Type Epitaxial CaF┣D22┫D2 Layers on Si (111)

    SHUN-ICHIRO OHMI

    Japanese Journal of Applied Physics   33 ( 4B )   2395 - 2400   1994

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Presentations

  • ECRスパッタ法により形成したHfN/HfSiON/Si(100)ゲートスタック構造の評価

    春季第57回応用物理学関係連合講演会  2010 

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  • ウェットエッチングによるYb混晶化PtSiのパターニングに関する検討

    春季第57回応用物理学関係連合講演会  2010 

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  • Investigation of n-type properties of pentacene based on MOS diodes utilizing ultra thin metal interlayer

    2010 

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  • Electrical Properties of Hf/HfSiON/p-Si(100) Structure MIS capacitor by Using ECR-Sputtering

    2010 

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  • Dielectric layer dependence of electrical and physical properties of pentacene films

    2010 

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  • Dielectric layer dependence of electrical and physical properties of pentacene films

    2010 

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  • Investigation of n-type properties of pentacene based on MOS diodes utilizing ultra thin metal interlayer

    2010 

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  • Electrical Properties of Hf/HfSiON/p-Si(100) Structure MIS capacitor by Using ECR-Sputtering

    2010 

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  • RFマグネトロンスパッタ法によるPtSiゲート電極の形成

    春季第57回応用物理学関係連合講演会  2010 

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  • 2段階シリサイド化によるHf混晶化PtSiの極薄膜化にかんする検討

    春季第57回応用物理学関係連合講演会  2010 

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  • ECRスパッタ法による3次元構造上へのHfN/HfONゲートスタック構造の形成

    秋季第70回応用物理学会学術講演会  2009 

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  • ポストアニールによるYb混晶化PtSiの低抵抗率化に関する検討

    秋季第70回応用物理学会学術講演会  2009 

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  • Characteristics of pentacene based MOS diodes with thin gate dielectric

    2009 

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  • Retention Characteristics of poly(vinylidenefluoride-trifluoroethylene)MFIS diodes

    2009 

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  • Yb混晶化PtSiの結晶性に関する検討

    春季第56回応用物理学関係連合講演会  2009 

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  • Hf混晶化PtSiの耐熱性に関する検討

    春季第56回応用物理学関係連合講演会  2009 

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  • Investigation of characteristics of pentacene-based MOSFETs structures

    2009 

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  • 3次元構造上に形成したHfON薄膜の側壁部膜質の評価

    春季第56回応用物理学関係連合講演会  2009 

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  • ECRスパッタ法によるHfN/HfON積層構造の形成

    電子情報通信学会SDM研究会  2009 

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  • Characteristics of pentacene based MOS diodes with thin gate dielectric

    2009 

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  • Retention Characteristics of poly(vinylidenefluoride-trifluoroethylene)MFIS diodes

    2009 

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  • Investigation of characteristics of pentacene-based MOSFETs structures

    2009 

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  • 2段階シリサイド化によるHf混晶化PtSiの耐熱性向上に関する検討

    電子情報通信学会SDM研究会  2009 

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  • Hf混晶化PtSiのシリサイド化条件に関する検討

    第55回応用物理学関係連合講演会講演予稿集  2008 

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  • Ferroelectrics Characteristics of poly (vinylidene fluoride-trifluoroethylene) MFIS diodes

    2008年(平成20年)第55回応用物理学関係連合講演会  2008 

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  • RFスパッタ法による3次元構造上へのSiO2薄膜の形成

    第55回応用物理学関係連合講演会講演予稿集  2008 

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  • ECRスパッタ法による3次元ゲート構造上へのHfO2薄膜の形成

    第55回応用物理学関係連合講演会講演予稿集  2008 

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  • Characteristics of metal-ferroelectric-insulartor-semiconductor structures based on poly(vinylidene fluoride-trifluoroethylene)

    電子情報通信学会SDM研究会  2008 

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  • Ferroelectrics Characteristics of poly (vinylidene fluoride - trifluoroethylene) MFIS diodes

    2008 

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  • Hf結晶化PtSiの仕事関数変数機構の検討

    電子情報通信学会SDM研究会  2008 

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  • Hf結晶化PtSiの仕事関数変調機構の検討

    電子情報通信学会SDM研究会  2008 

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  • Improvement of Pentacene Based MOS Diodes Characteristics by Surface Treatment of SiO2

    2008 

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  • Hf結晶化PtSiの結晶性に関する検討

    秋季第69回応用物理学会学術講演会  2008 

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  • Ferroelectrics Characteristics of poly (vinylidene fluoride - trifluoroethylene) MFIS diodes

    2008 

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  • ECRスパッタ法による3次元構造上へのHfOxNy薄膜の形成

    秋季第69回応用物理学会学術講演会  2008 

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  • RFマグネトロンスパッタ法によるPtSiゲート電極の形成

    秋季第69回応用物理学会学術講演会  2008 

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  • Improvement of Pentacene Based MOS Diodes Characteristics by Surface Treatment of SiO2

    2008 

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  • SBSIプロセスによる極薄SOI/BOX層の均一形成に関する検討

    第68回応用物理学会学術講演会  2007 

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  • Fabrication of SOI MOSFET by “Separation by Bonding Silicon Islands (SBSI) Method

    The 211th Meeting of The Electrochemical Society, Meeting Abstract  2007 

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  • 高誘電率HfOxNy絶縁膜のPDAプロセスの検討

    第68回応用物理学会学術講演会  2007 

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  • Mechanism of Selective Etching of SiGe Layers in SiGe/Si Systems

    The 211th Meeting of The Electrochemical Society, Meeting Abstract  2007 

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  • Fabrication of SOI MOSFET by “Separation by Bonding Silicon Islands (SBSI) Method

    The 211th Meeting of The Electrochemical Society, Meeting Abstract  2007 

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  • Investigation of PDA Process to Improve Electrical Characteristics of HfOxNy High-k Dielectric Formed by ECR Plasma Oxidation of HfN

    2007 International Symposium on Semiconductor Manufacturing  2007 

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  • HfNのECRプラズマ酸化により形成したHfOxNyのPDAプロセスの検討

    International Symposium on Semiconductor Manufacturing 2007 日本特別報告会  2007 

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  • Mechanism of Selective Etching of SiGe Layers in SiGe/Si Systems

    The 211th Meeting of The Electrochemical Society, Meeting Abstract  2007 

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  • SBSIプロセスによるSOI/BOX層の均一形成に関する検討

    電子情報通信学会SDM研究会  2007 

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  • ECRプラズマプロセスによるHfO2系絶縁膜の極薄膜化の検討

    電子情報通信学会SDM研究会  2007 

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  • Investigation of PDA Process to Improve Electrical Characteristics of HfOxNy High-k Dielectric Formed by ECR Plasma Oxidation of HfN

    2007 International Symposium on Semiconductor Manufacturing  2007 

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  • Hfとの混晶化によるPtSiの仕事関数変調

    電子情報通信学会SDM研究会  2007 

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  • Characterization of n-MISFETs with Ultrathin HfO_x_N_y_ Gate Insulator Formed by ECR-Ar/N_2_ Plasma Nitridation

    2006 Electronic Materials Conference  2006 

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  • A Proposal of Twin-Channel(TC)-MOSFET and its Fabrication Process

    2006 

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  • PtSiの混晶化による仕事関数変調

    電子情報通信学会SDM研究会  2006 

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  • Novel Fabricaition Process for Multi SOI Layers Using Selective Etching of SiGe in Multi Si/SiGe Layers

    2006 Electronic Materials Conference  2006 

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  • ECRプラズマプロセスによる高誘電率ゲート絶縁膜の形成

    電気学会電子・情報・システム部門大会講演論文集  2006 

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  • ECR-Ar/N_2_プラズマにより形成したHfO_x_N_y_膜を用いたn-MISFETの作製

    第53回応用物理学関係連合講演会講演予稿集  2006 

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  • TML-MOSFETにおける極微細3次元チャネル形成プロセスの検討

    第53回応用物理学関係連合講演会講演予稿集  2006 

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  • せり上げPtSi-SALICIDEにおける選択エッチングプロセスの検討

    第53回応用物理学関係連合講演会講演予稿集  2006 

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  • HfNのECRプラズマ酸化により形成したHfO_x_N_y_のゲート絶縁膜応用

    第67回応用物理学会学術講演会講演予稿集  2006 

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  • SBSI技術による極薄SOI/BOX層の形成

    第67回応用物理学会学術講演会講演予稿集  2006 

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  • Pt/HfO_x_N_y_/Si(100)ゲート積層構造の形成とPMA条件の検討

    第67回応用物理学会学術講演会講演予稿集  2006 

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  • A Proposal of Twin-Channel(TC)-MOSFET and its Fabrication Process

    2006 

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  • SBSIプロセスにおけるSi島の均一形成に関する検討

    第67回応用物理学会学術講演会講演予稿集  2006 

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  • Novel Fabricaition Process for Multi SOI Layers Using Selective Etching of SiGe in Multi Si/SiGe Layers

    2006 Electronic Materials Conference  2006 

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  • Characterization of n-MISFETs with Ultrathin HfO_x_N_y_ Gate Insulator Formed by ECR-Ar/N_2_ Plasma Nitridation

    2006 Electronic Materials Conference  2006 

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  • 半導体の基礎:半導体とはどのようなものであるか

    2006半導体入門セミナー  2006 

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  • HfNのECRプラズマ酸化によるHfON薄膜の形成

    電子情報通信学会SDM研究会  2006 

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  • 耐熱性金属との混晶化によるPtSiの仕事関数制御とせり上げsalicideプロセスへの応用

    International Symposium on Semiconductor Manufacturing (ISSM) 2005 日本特別報告会、 Conference Proceedings  2005 

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  • ECRスパッタ法による3次元ゲート構造上への高誘電率絶縁膜の形成

    2005 

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  • 新構造TML(Twin-Multi-Layer Channel)MOSFET

    2005 

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  • ECR Ar/N_2_ Plasma Nitridation of HfO_2_ for High-k Gate Insulator Applications

    2005 

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  • 希土類酸化物薄膜のHigh-kゲート絶縁膜応用

    日本化学会第85春季年会  2005 

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  • Si/Pt/Si(100)積層構造のシリサイド化によるPtSiの形成

    2005 

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  • HfNのECR Ar/O_2_プラズマ酸化プロセスによる極薄HfSiONの形成

    電子情報通信学会SDM研究会  2005 

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  • 耐熱性金属との混晶化によるPtSiの仕事関数制御とせり上げsalicideプロセスへの応用

    International Symposium on Semiconductor Manufacturing (ISSM) 2005 日本特別報告会、 Conference Proceedings  2005 

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  • 多層Si/SiGe構造におけるSiGe層横方向選択エッチングと多層SOI構造の形成

    電子情報通信学会SDM研究会  2005 

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  • ECR-Ar/N_2_プラズマにより形成したHfON膜の極薄膜化に関する検討

    電子情報通信学会SDM研究会  2005 

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  • TML(Twin-Multi-Layer Channel) MOSFETの作製プロセスに関する検討

    第66回応用物理学会学術講演会講演予稿集  2005 

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  • Effect of Ultra-thin Ti Layer on PtSi Work Function Modulation

    2005 IEEE International Symposium on Semiconductor Manufacturing, Conference Proceedings  2005 

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  • HfNのECR Ar/O_2_プラズマ酸化プロセスによる極薄HfSiONの形成

    第66回応用物理学会学術講演会講演予稿集  2005 

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  • 極薄HfO_2_薄膜のECR Ar/N_2_プラズマ窒化条件の検討

    第66回応用物理学会学術講演会講演予稿集  2005 

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  • ECR Ar/N_2_ Plasma Nitridation of HfO_2_ for High-k Gate Insulator Applications

    2005 

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  • Effect of Ultra-thin Ti Layer on PtSi Work Function Modulation

    2005 IEEE International Symposium on Semiconductor Manufacturing, Conference Proceedings  2005 

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  • HfO_x_N_y_ Thin Films Formed by ECR Ar/O_2_ Plasma Oxidation of HfN Thin Films

    2004 

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  • Separation by Bonding Si Islands (SBSI) for LSI Applications

    2004 

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  • Separation by Bonding Si Islands (SBSI) for Adavnced CMOS LSIs

    2004Asia-Pacific Workshop on Fundamentals and Application of Advanced Semiconductor Devices  2004 

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  • A Study on Selective Etching of SiGe Layers and Electrical Characteristics of MOS Diodes Formed after Selective Etching in SBSI Process

    2004 

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  • HfNのECR Ar/O_2_プラズマ酸化によるHfO_x_N_y_薄膜の形成

    2004 

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  • AlO_x_/Si(100)界面特性のECRスパッタ条件依存性

    2004 

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  • Novel SOI Fabrication Process Utilizing the Selective Etching for Si/SiGe Stacked Layers: Separation by Bonding Si Islands Technology (SBSI)

    2004 

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  • Separation by Bonding Si Islands (SBSI) for LSI Applications

    2004 

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  • Separation by Bonding Si Islands (SBSI) for Adavnced CMOS LSIs

    2004Asia-Pacific Workshop on Fundamentals and Application of Advanced Semiconductor Devices  2004 

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  • Novel SOI Fabrication Process Utilizing the Selective Etching for Si/SiGe Stacked Layers: Separation by Bonding Si Islands Technology (SBSI)

    2004 

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  • A Study on Selective Etching of SiGe Layers and Electrical Characteristics of MOS Diodes Formed after Selective Etching in SBSI Process

    2004 

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  • 極薄希土類酸化膜/Si(100)界面構造(極薄ゲート絶縁膜・シリコン界面の評価技術・解析技術)

    電子情報通信学会技術研究報告、SDM、シリコン材料・デバイス  2003 

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  • A Proposal of Multi-Layer Channel MOSFET: The Application of Selective Etching for Si/SiGe Stacked Lyaers

    2003 

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  • Effect of Vacuum Annealing on High-k Dy_2_O_3_ Thin Films Deposited on Si(100)

    2003 

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  • AlON Thin Films Formed by ECR Plasma Oxidation for High-k gate Insulator Application

    2003 

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  • A Study on Etching of SiGe Layers in SiGe/Si Systems for Device Applications

    2003 

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  • Effect of Vacuum Annealing on High-k Dy_2_O_3_ Thin Films Deposited on Si(100)

    2003 

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  • Electrical characteristics of rare-earth oxides stacked-layer structures

    2003 

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  • A Proposal of Multi-Layer Channel MOSFET: The Application of Selective Etching for Si/SiGe Stacked Lyaers

    2003 

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  • Electrical characteristics of rare-earth oxides stacked-layer structures

    2003 

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  • AlON Thin Films Formed by ECR Plasma Oxidation for High-k gate Insulator Application

    2003 

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  • A Study on Etching of SiGe Layers in SiGe/Si Systems for Device Applications

    2003 

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  • High-k ゲート絶縁膜用酸化物材料の研究

    電気学会電子材料研究会  2001 

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Awards

  • JJAP Editorial Contribution Award

    2007  

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  • JJAP Editorial Contribution Award

    2007  

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  • 応用物理学会論文賞解説論文賞

    2002  

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  • 手島記念研究賞博士論文賞

    1997  

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    Country:Japan

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